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1 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
2 etching
травлення (див. т-ж etch) - anisotropic etching
- anode etching
- batch etching
- blanket etching
- chemically assisted etching
- concentration dependent etching
- crystallographically sensitive etching
- deep reactive ion etching DRIE
- deep reactive ion etching
- differential etching
- digital etching
- diode ion etching
- diode etching
- dip etching
- directional etching
- dislocation etching
- dry process etching
- dry etching
- electron-beam induced etching
- excessive etching
- exciraer laser etching
- gas-phase plasma-assisted etching
- high-frequency ion etching
- hydrogen reactive ion etching
- ion etching
- ion-assisted plasma etching
- ion-beam induced etching
- isotropic etching
- jet etching
- laser-enhanced etching
- laser-induced pattern projection etching
- laser radical etching
- lateral etching
- lift-off etching
- light-induced etching
- low-pressure plasma etching
- low-pressure etching
- masked etching
- maskless etching
- maskless laser etching
- mesa etching
- microwave plasma etching
- microwave etching
- mild etching
- nonundercutting etching
- orientation-dependent etching
- oxygen gas plasma etching
- permeation etching
- photochemical etching
- photoelectrochemical etching
- photo-enhanced chemical dry etching
- photoexcited etching
- photo-initiated etching
- photoresist-masked etching
- plasma reactor etching
- plasma etching
- post etching
- preferential etching
- radical plasma etching
- radical etching
- radio-frequency plasma etching
- reactive ion etching
- regenerative etching
- resistless etching
- selective etching
- sharp etching
- sideways etching
- single-step laser etching
- spray etching
- sputter etching
- steady-state etching
- synchrotron radiation-assisted etching
- taper etching
- tetrode ion etching
- tetrode etching
- triode ion etching
- triode etching
- undercuttingetching
- undercutetching
- UV laser etching
- vacuum ultraviolet-assisted etching
- vertical etching
- VUV-assisted etching
- wet chemical etching
- wet etching
- zero-undercut etching
См. также в других словарях:
Deep-etch process — Глубокое травление; Способ изготовления офсетных форм с углублением элементов … Краткий толковый словарь по полиграфии
Deep reactive-ion etching — (DRIE) is a highly anisotropic etch process used to create deep penetration, steep sided holes and trenches in wafers, with aspect ratios of 20:1 or more. It was developed for microelectromechanical systems (MEMS), which require these features,… … Wikipedia
Advanced Silicon Etch — (ASE) is a deep reactive ion etching (DRIE) technique to rapidly etch deep and high aspect ratio structures in silicon.ASE was pioneered by Surface Technology Systems Plc. (STS) in 1994 in the UK. STS has continued to develop this process with… … Wikipedia
Reactive-ion etching — (RIE) is an etching technology used in microfabrication. It uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High energy ions from the plasma… … Wikipedia
Photolithography — For earlier uses of photolithography in printing, see Lithography. For the same process applied to metal, see Photochemical machining. Photolithography (or optical lithography ) is a process used in microfabrication to selectively remove parts of … Wikipedia
John Heuser — Infobox Scientist name = John Edward Heuser image width = 151px caption = John Heuser birth date = birth date and age|1942|08|29 birth place = Pittsburgh, Pennsylvania field = Cell Biology, Physiology, Biophysics, Electron Microscopy work… … Wikipedia
Printed circuit board milling — is the process of removing areas of copper from a sheet of printed circuit board material to recreate the pads, signal traces and structures according to patterns from a digital circuit board plan known as a layout file. Similar to the more… … Wikipedia
printing — /prin ting/, n. 1. the art, process, or business of producing books, newspapers, etc., by impression from movable types, plates, etc. 2. the act of a person or thing that prints. 3. words, symbols, etc., in printed form. 4. printed material. 5.… … Universalium
Outer segment disc shedding — The retina contains two types of photoreceptors – rods and cones. There are about 6 7 million cones that provide color vision to the eye, and they are very concentrated in a central spot in the retina, called the macula. However, the rods are… … Wikipedia
Disc shedding — The retina contains two types of photoreceptor – rod cells and cone cells. There are about 6 7 million cones that provide color vision to the eye, and they are very concentrated in a central spot in the retina, called the macula. However, the… … Wikipedia
Dry etching — refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes… … Wikipedia
